ADI's data acquisition solution shines in advanced lithography chip manufacturing
Figure 2: A block diagram of the ADAQ7768-1 µModule. (Image source: Analog Devices, Inc.)
By integrating passive components such as resistors and capacitors and active components such as op-amps, references, low dropout regulators (LDOs), and A/D conversion, μModules guarantee the performance of a complete signal chain over temperature and power supply variations. This ensures precise and repeatable high-performance signal chains for acquiring signals from pressure, temperature, and vibration sensors.
signal conditioning components such as amplifiers and filters, and power management and reference circuitry. The 24-bit ADC enables precise measurements of delicate parameters such as vibration levels in wafer stages, thermal variations in optical assemblies, and sub- nanometer positioning errors. Multiple sensors—such as pressure, temperature, and vibration—can be wired to the ADAQ7768-1's analog front end (AFE), which includes multiple active and passive components. Multiple modules can be used in parallel to manage data from a large array of sensors,
Signal chain performance In each lithography semiconductor manufacturing system, the performance of each sensor is critical. ADI's ADAQ7768-1 (Figure 1) is a DAQ system based on the company's µModule technologies that is designed to simplify and enhance the performance of precision measurement and control systems. The single system-in-package (SiP) solution incorporates high input impedance amplification, anti- aliasing, signal conditioning, analog-to-digital (A/D) conversion, and configurable digital filtering blocks.
The ADAQ7768-1 integrates multiple components into a
single µModule, as shown in the Figure 2 block diagram. These include a 24-bit precision analog- to-digital converter (ADC),
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