Because of the WBG capability in SiC technology, voltage levels can be higher, which has enabled the next generation of technology implementation. The challenge is that SiC is a complex material to work with given it’s a significantly stiffer base material than traditional silicon. Power cycling is a key factor in package development, as it puts strain on the interconnection
Power conversion market innovations One area these experts are excited about is the decarbonization of the grid, which involves transitioning away from fossil fuel power plants (like coal and oil). “Decarbonization can happen both at the macro level with changes power companies are making to switch to wind, solar and hydropower, but also at the consumer level through EVs and the like,” said Luke. “Enablers like SiC are helping us get closer to microgrids more than ever before, localizing power sources for less conversion and loss, aiding in decarbonization.” Another innovation they see as having a strong impact on the power sector is the implementation of solid-state transformers. These can greatly enhance the infrastructure of the power grid, reducing the size, installation time and overall complexity of the utility site. Deploying solid- state transformers enables modular, high-voltage systems and microgrid solutions, leading to more sustainable power distribution.
What’s next? With new technology rolling out constantly, SiC is predicted to have a lasting presence. “Infineon experts predict silicon power switching devices will continue to dominate the market for the remainder of the decade,” said Williams. “We have a unique position in the market by offering all three switching technologies: silicon, silicon carbide and gallium nitride and see no threat from wide bandgap power devices reducing the total market size.” Companies like Infineon are investing in scaling manufacturing to increase capacity and developing solutions that improve power efficiency while reducing the cost of SiC technology. Innovations such as modular microgrids, distributed DC networks, and fusion reactors are on the horizon, with SiC at the core of these advancements. Through a strong partnership with its global distributor, DigiKey, the rapid deployment of new technologies through a no-minimum-order and high- availability distribution model, designers and engineers are well-positioned to run with all that is next. For more information on power solutions, visit DigiKey.com.
between the SiC die and its leadframe or substrate,
potentially leading to premature device failure. Developing new interconnection technologies to improve the power cycling performance of future SiC devices
is important in addressing the future requirements of a decarbonized grid.
“Applications now utilize much higher power cycling than the motor-drive applications of the past,” said Williams. “Infineon has been focused on developing our .XT technology, an advanced interconnection technology proven to increase power cycling performance >22 times versus standard soft solder techniques. This technology development enables higher power density, improved thermal performance, and maximum system lifetime, enabling the shift to more renewable energy sources.”
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