■ 9-axis sensor with accelerometer, gyroscope, and magnetometer ■ Ambient light sensor ■ Humidity and temperature sensor ■ UART to USB ■ 2x6 TMD GPIO Header ■ Bluetooth SPP, using HC-05 module with up to 10-metre range The Intel Cyclone SoC FPGA is a customisable ARM processor- based SoC that supports lower system power, lower cost, and less board space by integrating a hard processor system (HPS) that includes processors, peripherals, and a memory controller, with a low-power FPGA fabric using a high-bandwidth interconnect. These SoCs are especially suited for high-performance IoT Edge applications. Summary Adding Cloud connectivity to IoT devices and sensors need not be a difficult task that diverts resources from the design of the primary device functionality. Designers can turn to MCU and FPGA-based environments that support quick and efficient connectivity to the Amazon AWS and Microsoft Azure Clouds. These development kits include comprehensive suites of sensors, wired and wireless communications options, and sample application programs that provide safe and secure Cloud connectivity.
Figure 6: Terasic’s FPGA Cloud Connectivity Kit combines the DE10-Nano Cyclone V SoC FPGA board and the RFS daughter card. Image source: Terasic
includes the R5F565NEDDFP MCU rated for operation from -40 to +85°C
secure IP (Trusted Secure IP) is integrated and realises a high level of root-of-trust ■ Available encryption engines include AES, TRNG, TDES, RSA, ECC, SHA ■ Equipped with functions that protect Flash memory from unintended access ■ Cloud connectivity with an FPGA Designers that need FPGA performance and Cloud connectivity can turn to Terasic’s FPGA Cloud Connectivity Kit, which combines an Intel Cyclone V system on chip (SoC) FPGA, like the 5CSEBA5U23C8N, with Cloud connectivity. This dev kit is certified with Cloud service providers, including Microsoft Azure, and includes open source design examples that walk designers through the process of connecting an Edge device to the Cloud. The FPGA Cloud Connectivity Kit includes (Figure 6): ■ DE10-Nano Cyclone V SoC FPGA Board ■ RFS daughter card with: ■ Wi-Fi, using ESP-WROOM-02 module with up to 100-meter range
Renesas’ RX65N MCUs are well suited for Cloud and sensor solution endpoint devices. Features include: ■ 120MHz operation with single- precision FPU ■ 2.7 to 3.6 V operation ■ Only 0.19 mA/MHz is needed to support all peripheral functions ■ Four low-power modes for power/performance optimization ■ Communication interfaces include Ethernet, USB, CAN, SD host/slave interface, and quad SPI ■ Program Flash up to 2 MB, SRAM up to 640 KB ■ DualBank function simplified firmware updates Security: ■ National Institute of Standards and Technology (NIST) Federal Information Processing Standards (FIPS) 140-2 Level 3 Cryptographic Module Validation Program (CMVP) certification ■ Renesas’ proprietary hardware
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