Automated soldering with cobots is also appropriate where components are being assembled onto especially thin boards and the effects of silicon thermal expansion are a concern. Where cobots are destined to perform this and other assembly tasks, it’s often logical to integrate thermography or other board-inspection equipment onto the EoAT. That speeds error-proofing tasks for higher yields and quality assurance … often at relatively low cost.
Complicating matters is how increasingly fine details on increasingly miniaturized electronics necessitate roboticized assembly processes that follow suit. Robotics have risen to this challenge with motors, mechanical linkages, controls, and networks that allow evermore advanced capabilities. Complementary technologies such as machine vision and real-time industrial networking have also imparted new capabilities in robotics for manipulating, processing, and assembling high-volume semiconductor production.
Conclusion
Industrial robotics can provide affordable and flexible automation of semiconductor and electronics production. Technical challenges are the need to satisfy cleanroom ratings, high throughput, and careful handling of exceedingly expensive workpieces. Even so, today’s robotic hardware as well as robotic simulation software and programming have simplified the sizing and selection of cleanroom robotic solutions.
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